Electronics Forum | Sat May 30 08:24:09 EDT 1998 | Dave F
| | | | We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not locali
Electronics Forum | Sat May 30 12:51:29 EDT 1998 | Earl Moon
| | | | | We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not loca
Electronics Forum | Thu Oct 08 22:20:44 EDT 1998 | Dave F
| | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the rema
Electronics Forum | Fri Oct 02 16:49:33 EDT 1998 | Dave F
Benji: I tend to agree with you that assemblers shouldn't wear make-up. I'm unsure what first level assemblers are tho. I've been down that finger cot/glove route ... 1 If someone is going to smear facial or cosmetic oil on a board, they can do
Electronics Forum | Wed Sep 09 12:20:59 EDT 1998 | Dave F
| | We�ve been thinking again and need your help in sorting through an issue related to deionized (DI) water cleaning of assembled boards. | | THE BACKGROUND: The water reclaiming systems goes: gross filter, fine filter, carbon bed, mixed resin bed
Electronics Forum | Mon Jun 25 11:09:26 EDT 2001 | wbu
Who is this, another Dave F ? For me there�s no problem with balling and beading. I know that the boards I have with the new paste do have all what�s needed for balling and beading, just one of the oldest designs with a stencil ...., oh boy, didn�t
Electronics Forum | Wed Feb 02 11:48:48 EST 2000 | Christopher Lampron
Dave, Ashok mentioned that the end termination of the component were dull and grey. I have had similar problems with Murata components exibiting the same characteristics on the end terminations. As it turns out, they have some exotic plating material
Electronics Forum | Fri Jan 14 16:58:20 EST 2000 | Dave F
Dave: You're probably correct about too much paste, given that your balling is congrigated near the center of the chips. Three things to consider: 1 Lower temperature profile @ front 3 zones 2 I've heard some stencil suppliers can plate addition
Electronics Forum | Fri Dec 17 12:09:09 EST 1999 | Boca
Outstanding advice gentlemen! To borrow Dave F's line "I'd like to take a bit of a different angle." Ie. a few wave solder specific issues If this assembly is going over wave solder then avoid vias under passive components, it invites solder bal
Electronics Forum | Fri Dec 03 18:17:12 EST 1999 | Dave F
Dave: There's lots of stuff on the web describing BGAs. Examples are: http://www.smtnet.com/bookstore/publications/0speckdo1/s1.html http://www.smtnet.com/bookstore/publications/0shutcco1/ch1p2.html http://www.citizen-america.com/OEM/bga/process
